Chemical Formula:
Si
Stanford Nanofabrication Facility
Lab User Guide
Equipment Tables
| Equipment name & NEMO ID | Technique | Cleaning Required | Cleanliness | Primary Materials Etched | Other Materials Etched | Material Thickness Range | Materials Lab Supplied | Process Temperature Range | Chemicals | Gases | Substrate Size | Substrate Type | Maximum Load |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Technics Asher technics |
Flexible | Four 4" wafers to pieces, one 6" or 8" wafer | |||||||||||
|
Tystar Bank 1 Tube 1 Anneal B1T1 Flexible Oxide |
Flexible |
25.00 Å -
2.00 μm
|
400 °C - 1100 °C
|
100 | |||||||||
|
Tystar Bank 1 Tube 2 B1T2 Flexible Oxide |
Flexible |
25.00 Å -
2.00 μm
|
400 °C - 1100 °C
|
100 | |||||||||
|
Tystar Bank 1 Tube 3 Poly B1T3 Flexible Poly |
Flexible |
25.00 Å -
2.00 μm
|
420 °C - 630 °C
|
100 | |||||||||
|
Tystar Bank 1 Tube 4 LTO B1T4 Flexible LTO |
Flexible |
25.00 Å -
2.00 μm
|
300 °C - 500 °C
|
100 | |||||||||
|
Tystar Bank 2 Tube 5 B2T5 Clean Anneal |
Pre-Diffusion Clean | Clean |
25.00 Å -
2.00 μm
|
400 °C - 1100 °C
|
100 | ||||||||
|
Tystar Bank 2 Tube 6 B2T6 Clean Oxide |
Pre-Diffusion Clean | Clean |
25.00 Å -
2.00 μm
|
400 °C - 1100 °C
|
100 | ||||||||
|
Tystar Bank 2 Tube 7 Nitride B2T7 Flexible Nitride |
Flexible |
25.00 Å -
2.00 μm
|
420 °C - 800 °C
|
50 | |||||||||
|
Tystar Bank 2 Tube 8 LTO B2T8 Clean LTO |
Clean |
25.00 Å -
2.00 μm
|
300 °C - 500 °C
|
100 | |||||||||
|
Tystar Bank 3 Tube 10 Nitride B3T10 Clean Nitride |
Pre-Diffusion Clean | Clean |
25.00 Å -
2.00 μm
|
420 °C - 800 °C
|
50 | ||||||||
|
Tystar Bank 3 Tube 11 TEOS B3T11 Clean TEOS |
Pre-Diffusion Clean | Clean |
25.00 Å -
2.00 μm
|
420 °C - 630 °C
|
50 | ||||||||
|
Tystar Bank 3 Tube 12 Poly B3T12 Clean Poly |
Pre-Diffusion Clean | Clean |
25.00 Å -
2.00 μm
|
420 °C - 630 °C
|
50 | ||||||||
|
Tystar Bank 3 Tube 9 B3T9 Clean Oxide |
Pre-Diffusion Clean | Clean |
25.00 Å -
2.00 μm
|
400 °C - 1100 °C
|
100 | ||||||||
|
Wet Bench Clean 1 wbclean-1 |
Clean | 25 | |||||||||||
|
Wet Bench Clean 2 wbclean-2 |
Clean | 25 | |||||||||||
|
Wet Bench Clean_res- hotphos wbclean_res-hotphos |
Clean | ||||||||||||
|
Wet Bench Clean_res-hf wbclean_res-hf |
Clean | ||||||||||||
|
Wet Bench Clean_res-piranha wbclean_res-piranha |
Clean | ||||||||||||
|
Wet Bench CMOS Metal wbclean3 |
Semiclean | 25 wafers | |||||||||||
|
Wet Bench Decontamination wbdecon |
Clean |