Clean

The "Clean" cleanliness group is part of the SNF/ExFab contamination policy.

The following is a list of equipment that fall into the "Clean" category.

Equipment Tables

Equipment name & NEMO ID	Technique	Cleanliness	Primary Materials Etched	Process Temperature Range	Chemicals	Substrate Size	Substrate Type	Maximum Load
Wet Bench Clean_res-hf wbclean_res-hf	Etching > Wet Etching > Silicon Oxide Wet Etching Wet Chemical Processing	Clean	SiO₂		20:1 BOE 50:1 HF 6:1 BOE	3" 4" 6"	Silicon (Si) Silicon Germanium (SiGe) Quartz (SiO2)
Wet Bench Clean_res-piranha wbclean_res-piranha	Cleaning > Piranha Cleaning Cleaning > Resist Removal > Wet Resist Removal Wet Chemical Processing	Clean			9:1 Piranha	3" 4" 6"	Silicon (Si) Silicon Germanium (SiGe) Quartz (SiO2)
Wet Bench CMOS Metal wbclean3	Etching > Wet Etching > Aluminum and Titanium and Tungsten Wet Etching Wet Chemical Processing	Semiclean	Al Ti W		20:1 BOE 50:1 HF 6:1 BOE Al-Etch Ti-Etch W-etch	3" 4" 6"	Silicon (Si) Silicon Germanium (SiGe) Quartz (SiO2)	25 wafers
Wet Bench Decontamination wbdecon	Cleaning > Decontamination Wet Chemical Processing	Clean			SC2	3" 4" 6"	Silicon (Si) Silicon Germanium (SiGe) Quartz (SiO2)
Wet Bench Resist Strip wbresstrip-1	Cleaning > Resist Removal > Wet Resist Removal Wet Chemical Processing	Clean (Ge), Semiclean, Flexible	Resist	20 °C - 60 °C	PRS-1000 SRS-100	Pieces 2" 3" 4"	Silicon (Si) Silicon Germanium (SiGe) Quartz (SiO2) Sapphire (Al₂O₃) Glass (SiO₂) Germanium (Ge) Silicon Carbide (SiC)	25 4 inch wafers