Machining techniques are physical methods of shaping materials (in contrast to primarily chemical methods).
| Processing Technique | Equipment name & NEMO ID | Cleanliness | Substrate Size | Maximum Load (number of wafers) | Stylus Tip Radius |
|---|---|---|---|---|---|
| Wafer Polishing |
CMP GnP POLI-400L cmp |
Flexible | |||
| Machining |
DISCO Backgrinder disco-backgrind |
Flexible | |||
| Wafer Saw |
DISCO Wafer Saw DISCO wafersaw |
Flexible | 1x4", 1x6" or 1x8" wafer, or pieces | ||
| Laser Cutting |
Epilog Fusion M2 Laser Cutter lasercutter |
Flexible | |||
| Micromilling |
Minitech-GX Micromill micromill |
Flexible |