Sputtering is a physical vapor deposition method of thin film deposition. This involves ejecting material from a "target" that is a source onto a "substrate".
| Processing Technique | Equipment name & NEMO ID | Cleanliness | Materials Lab Supplied | Material Thickness Range | Substrate Size | Maximum Load (number of wafers) | Process Temperature Range | Gases | Notes | Stylus Tip Radius |
|---|---|---|---|---|---|---|---|---|---|---|
| Sputtering |
Hummer V Sputter Coater hummer |
Flexible | ||||||||
| Sputtering |
Lesker Sputter lesker-sputter |
Flexible | 1 4 inch wafer, 1 6 inch wafer |
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter |
||||||
| Sputtering |
Lesker2 Sputter lesker2-sputter |
Semiclean |
1.00 μm
|
one 4 inch wafer, one 6 inch wafer |
°C - 800 °C
|
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter |