Resists contain solvents which are used to control the viscosity of the materials during coating, and bakes are used to drive out solvents to control the resist patterning quality.
| Processing Technique | Equipment name & NEMO ID | Cleanliness | Exposure Wavelength | Substrate Size | Process Temperature Range | Notes | Stylus Tip Radius |
|---|---|---|---|---|---|---|---|
| Oven Bake |
Oven (White) white-oven |
Flexible |
0 °C - 200 °C
|
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable. |
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| Resist Post Bake |
Oven 110°C post-bake oven110 |
"All" |
110 ºC
|
Bakes wafers with resist after the development, called post-bake. |
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| Resist Prebake |
Oven 90°C prebake oven90 |
"All" |
90 ºC
|
Bakes wafers after resist coating. |
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| Oven Bake |
Oven BlueM 200°C to 430°C bluem |
Flexible |
0 °C - 430 °C
|
Convection in N2. Cure. Programmable. |
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| Resist UV Cure |
Ultraviolet Photoresist Cure uvcure |
"All" | 254 nm |