Rapid fabrication of curved metasurfaces through wafer grinding

Project Type:

E241

Date:

June 2022 (all day)

Areas of Interest:

Wafer Grinding, PDMS processing, Creating PDMS molds

Report:

Rapid fabrication of curved metasurfaces through wafer grinding

Researchers and (Mentors):

Robert Lupoiu, Chenkai Mao, Yixuan Shao, (Swaroop Kommera), (Lavendra Mandyam), (J Provine)

List of Important Equipment:

DISCO Backgrinder (disco-backgrind)

PDMS Workbench ()

Heidelberg MLA 150 (heidelberg)

Heidelberg MLA 150 - 2 (heidelberg2)

Nano Nugget:

Wafer protection using blue sticky tape for spin-coating PDMS

Read more about Wafer protection using blue sticky tape for spin-coating PDMS

Using the drop gauge to measure the thickness and compression amount of PDMS films

Read more about Using the drop gauge to measure the thickness and compression amount of PDMS films

Creating molds for the casting of thick, uniform PDMS

Read more about Creating molds for the casting of thick, uniform PDMS

Materials

PDMS