Hydrogen peroxide mixtures are used for etching common CMOS metals like Al, Ti and W.
| Processing Technique | Equipment name & NEMO ID | Cleanliness | Chemicals | Primary Materials Etched | Other Materials Etched | Substrate Size | Maximum Load (number of wafers) | Notes | Stylus Tip Radius |
|---|---|---|---|---|---|---|---|---|---|
| Aluminum and Titanium and Tungsten Wet Etching, Wet Chemical Processing |
Wet Bench CMOS Metal wbclean3 |
Semiclean | 25 wafers |
Al, Ti, or W wet etching or oxide etching |
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| Decontamination, Metal Clean, Piranha Cleaning, Wet Resist Removal, Acid or Base Wet Etching, Aluminum and Titanium and Tungsten Wet Etching, Silicon Wet Etching, Silicon Oxide Wet Etching, Wet Chemical Processing |
Wet Bench Flexcorr 1 wbflexcorr-1 |
Flexible |
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only. |